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The reporter learned a few days ago that Texas Instruments (TI) used RFID to manage the 90-nanometer process in the DMOS-6 wafer fab to etch circuit systems on 300-mm wafers.
Roy Hunter, director of DMOS-6 factory automation, said that the RFID tag tells the semiconductor processing equipment which process needs to be performed on the wafer, and the specific process information is stored in a central computer.
In the original 300mm wafer manufacturing, workers needed to move the wafers during different business processes and manually scan the wafers using barcode technology. Since the use of RFID, TI said that it has not only drastically reduced the labor intensity of the fab staff, but also reduced the number of wafers broken during the operation. However, the company declined to disclose the specific percentage of changes.
RFID is widely used in wafer processing, and it is reported that it has become the de facto standard in this field.
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