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In recent years, the market for portable devices such as mobile phones has continued to develop rapidly. It is estimated that mobile phone shipments will increase from 1.4 billion units in 2011 to 1.8 billion units in 2014; among them, the smartphone market is dazzling, driven by the launch of a large number of low-cost Android phones, and smartphone shipments will increase from 4 100 million units increased to 680 million units, and the content of semiconductor components in smart phones is much higher than that of functional or entry-level phones. At the same time, leading manufacturers pay more attention to user experience, and one of their measures is to select products and solutions that can better meet the application requirements and technology trends of portable devices such as smart phones in product design.
As the world’s leading silicon solution provider for energy-efficient electronic products, ON Semiconductor provides a wealth of solutions for portable applications. This article will focus on how ON Semiconductor’s high-performance and energy-efficient solutions meet the requirements and technology trends of portable applications such as smart phones, and help design engineers choose suitable component solutions.
Highly integrated PMIC simplifies design and speeds up the product launch process
As we all know, there are more and more integrated functions of portable devices, ranging from taking pictures to playing audio and video, games and even location services. With the 3G and even 4G network infrastructure in place, users are becoming more and more accustomed to wirelessly accessing rich data and multimedia content through portable devices such as smartphones, requiring portable devices to embed more and more powerful radio frequencies (RF). Module. The corresponding price is that power consumption is getting higher and higher, and the progress of battery capacity and technology is still slow. Portable device designers must adapt to this high integration trend that combines many functions, provide long enough battery life, and cooperate with consumption. The demand for slim profile.
In order to meet these challenges, a feasible strategy for portable device designers is to choose a main chipset that integrates multiple functions, while choosing a highly integrated power management integrated circuit (PMIC) to help simplify the design and make the control power required Minimize resources and keep the form factor within a controllable range.
ON Semiconductor offers a series of miniature power management IC (mini-PMIC), and its functional schematic diagram is shown in Figure 1. These miniature power management ICs integrate multiple DC-DC switching converters or low-dropout (LDO) linear converters, and may also integrate other control or protection functions, such as bus control, sequencer, and power good (PG) monitoring , Enable (Enable), band gap reference, oscillator, under-voltage lockout and thermal shutdown protection functions or dynamic voltage regulation (DVS), etc. ON Semiconductor’s mini-PMIC currently includes NCP6922, NCP6914, NCP6924 and NCP69xy (increasing power and function).
Take NCP6922 as an example. This mini-PMIC provides 4 voltage rails from 0.6 V to 3.3 V output (2 DC-DC plus 2 LDO), and integrates the core, power-on sequencer, thermal protection and clock, etc. A variety of functions (see Figure 2 for details), using a 2.05 mm x 2.05 mm CSP package, not only reduces the size of the solution, but also provides design flexibility through I2C control. ) And/or a battery-powered portable device with a microprocessor. This device supports an input voltage range of 2.3 V to 5.5 V, with the latest battery technology; it also supports a DC-DC operating frequency of up to 3 MHz, which can reduce the size of the output inductance and capacitor; the quiescent current consumption is as low as 64 μA, helping to extend the battery Use time; it also supports dynamic voltage regulation (DVS) to improve system energy efficiency.
It is worth mentioning that this series of mini-PMICs of ON Semiconductor can provide customized power-on sequencing functions to meet the application requirements of different platforms. The integrated LDO in this series of ICs can be powered by DC-DC output to further improve energy efficiency. Other advantages include providing design flexibility with I2C control, supporting voltages as low as 2.3 V to match new battery technologies, and providing QFN and CSP packages with pitches as low as 0.4 mm. ON Semiconductor also provides a wealth of intellectual property (IP) libraries and modular approaches to help customers cope with the trend of high integration and speed up the product launch process.
Step-down or step-up DC-DC switching regulator with application processor power supply or HDMI port power supply
Although the applications of highly integrated PMICs are increasing, in portable products, not all power domains need to use highly integrated PMICs. As the functions of portable products continue to increase, the demand for relatively low-integrated power conversion ICs has also increased to complement the addition of new functions.
For example, for portable products, in order to power high-power application processors, designers may need to use DC-DC switching regulators. ON Semiconductor has introduced a relatively low-integration series of DC-DC switching step-down converter ICs, such as NCP6334B/C, NCP6338, and NCP636x modules. These ICs all accept input voltages from 2.3 V to 5.5 V and work with the latest battery technology. Take NCP6334B/C as an example. This is a 2 A, 3 MHz DC-DC step-down converter, which integrates good power (PG) and working mode selection (PWM mode or PFM/PWM automatic mode) functions. The cost-saving and space-saving solution is very suitable for powering new microprocessors that require low-voltage high-power. NCP6338 has similar functions to NCP6334, but can provide up to 6 A output current to meet the needs of the latest processors. The NCP636x module is a 0.8 A, 6 MHz DC-DC step-down converter module. The switching frequency of up to 6 MHz facilitates the use of smaller external components, making the total solution size less than 5 mm2 (maximum height 1 mm), which is especially suitable Portable applications with extremely limited tolerances.
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