Shanghai Xiupai successfully completed the chip tray positioning and search management system of Intel’s global production plants
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As one of Intel’s two major RFID technology application cases in the world, Shanghai Supai Electronic Technology Co., Ltd. has stood out among many RFID manufacturers around the world with its leading technology and solutions, and has become the solution of Intel’s global production plant CPU chip tray positioning and search management system Providers of solutions and products.
As one of the most well-known companies in the world, how to accurately and intelligently track, locate, locate, and determine the placement of each chip in the entire production process during the production process has been a problem that has plagued Intel for many years. The big problem, after more than two years of project technical discussion and solution drafting, several major reference products including RFID technology and WIFI technology have been determined.
After a large number of preliminary technical demonstrations and strict on-site testing, Shanghai Xiupai Company has won the bid in one fell swoop in competition from many manufacturers including the United States, Europe and China with its obvious technical advantages and unique solutions.
Due to the particularity of Intel’s production process, there is a lot of fluidity in the production process of products, and how to find the solution has become the key to the solution. Relying on the long distance recognition of its own products, high recognition reliability, ultra-low power consumption, extremely low on-site environmental requirements and strong secondary technology development capabilities, Supai has proposed a solution for super tags. In addition to the tags in a radius of 50 meters It can be recognized within the range, and it can also actively communicate with the host computer. At the same time, it can be prompted by a variety of sound/light methods, and it can meet the requirements of small size and long service life of the label.
Intel has applied for related patents in the United States for this project, and Intel believes that it may have a global advanced level. The program was publicly exhibited at IMEC 2006 (Intel Manufacturing for Excellence Conference) at the end of June.
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